Enrique Dans' article highlights a significant shift in the semiconductor industry, where chip packaging has evolved from a peripheral final step to a central driver of innovation, particularly for AI applications.
The piece emphasizes how TSMC, a leading chip manufacturer, has pioneered advanced packaging technologies like CoWoS and SoIC, enabling the creation of more powerful and energy-efficient chips by integrating multiple dies.
This has created high demand from major players like Nvidia and AMD, leading to production bottlenecks and underscoring the strategic importance of advanced packaging capacity. The article also touches on the geopolitical implications of this concentration of advanced capabilities in Taiwan.
The subsequent comments discuss related topics, including the competitive landscape of chip manufacturing, the reliability of global technology supply chains, and even unrelated observations on streaming services and political satire.
This article is also available in English on my Medium page, «How TSMC is redefining the future of chip design«
