Technology Leadership & Innovation:
- Advanced Nodes: TSMC is expanding 3nm capacity and preparing for multiple phases of 2nm fabs to meet customer demand. The company is also actively developing the A16 technology (1.6 nm), which is set for volume production in the second half of 2026.
- Quote: “Given the robust multiyear demand for our 3 nanometer technology, we continue to expand our 3 nanometer capacity in Tainan Science Park. We are also preparing for multiple phases of 2 nanometer fabs in both Hsinchu and Kaohsiung Science Park to support the strong structural demand from our customers.”
- A16: TSMC's A16 technology promises 8-10% speed improvement at the same power, or 15-20% power improvement at the same speed, along with a 7-10% density gain compared to N2P, targeting high-performance computing (HPC) applications with complex signal routing.
- Quote: “Compared with the N2P, A16 provide a further 8% to 10% speed improvement at the same power or 15% to 20% power improvement at the same speed, and additional 7% to 10% chip density gain. A16 is the best suitable for specific HPC product with a complex signal route and dense power delivery network.”
- Advanced Packaging: TSMC is expanding advanced packaging facilities across Taiwan, focusing on CoWoS and SoIC to support AI and other high-performance applications.
- Quote: "We are also expanding our advanced packaging facilities across several location in Taiwan.”
