In this episode, we continue our conversation from last episode with Dave Wilcox, PCB CAM engineer at CircuitHub, to explore the intricacies of plugging and filling vias.
Topics Covered:
- The differences between plugging and filling vias, and when to use each method.
- The common challenges faced during the reflow process, including the infamous "popcorn effect" caused by trapped flux.
- Practical advice on preventing manufacturing issues related to via plugging.
- Cost considerations between tenting, plugging, and filling vias.
- Insights into using various materials for via filling, including epoxy and solder.
- A fascinating case study on using solder to plug vias for gas sensors.
- The importance of thoughtful PCB design and silkscreen placement to avoid manufacturing headaches.
Key Takeaways:
- Plugging vias can prevent air and flux entrapment, but must be carefully specified in the design.
- There’s a delicate balance between cost and functionality when choosing how to handle vias.
- Thoughtful design and clear communication with manufacturers can lead to smoother production and better results.
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