Manufacturing Matters welcomes Philip Colet, VP sales and marketing at Teledyne DALSA, to discuss the latest in machine vision and imaging, including semiconductor inspection, SWIR/UV, line scan imaging, and more.
Colet talks about semiconductor inspection and how represents a strong market for the company, as they sell many products to inspection and manufacturing equipment OEMs. Additional topics include Teledyne DALSA’s line scan cameras –which generate very high-resolution images at a lower cost—as well as finding the right wavelength for an application.
For example, certain applications require sensors and cameras with SWIR or UV sensitivity to detect features and defects beyond the visible wavelength. Additionally, Teledyne DALSA is developing solutions for another expanding market: agriculture and food production. Colet discusses what needs to happen for farmers to adopt enabling technologies at a larger scale.
