Mike Steep, Executive Director, Stanford Engineering Center for Disruptive Technology and Digital Cities, and Former SVP of Global Business Operations at PARC Xerox, and Stephanie Neil, Editor-in-Chief, OEM Magazine
Get ahead of inevitable business disruption with practical tips for fueling innovative ideas powered by new technology.
PACK EXPO East returns to Philly in February 2026. It’s your east coast connection for packaging and processing solutions. Be there to catch up on the latest industry advances, connect with suppliers and land on the right solutions for your entire production line—from automation and sustainability to e-commerce and much more. Register today at packexpoeast.com.
