Samsung is Back: The HBM4 Revolution and Nvidia’s Vera Rubin
The wait is over for the AI hardware world. On February 8, 2026, reports confirmed that Samsung Electronics is set to begin the world’s first mass shipments of HBM4 (6th Gen High Bandwidth Memory) in the third week of February, immediately following the Lunar New Year holiday. This marks a historic "come-from-behind victory" for Samsung, which had previously struggled to keep pace with rivals in the HBM3E generation.
In this episode, we break down the staggering technical specs of these new chips: a data transfer speed of 11.7 Gbps (shattering the JEDEC 8 Gbps standard) and a bandwidth of 3 terabytes per second per stack. We explore Samsung’s unique manufacturing approach, combining their 1c nanometer DRAM process with a 4nm logic die from their own foundry. Plus, we analyze the strategic partnership with Nvidia, as these chips become the backbone of the next-generation Vera Rubin AI accelerator platform.
Samsung, HBM4, Nvidia, Vera Rubin, AI Accelerator, 11.7 Gbps, DRAM, Semiconductor, Pyeongtaek P4, Generative AI, Tech News 2026
This episode includes AI-generated content.
