Description

MEP EP#281: Through Hole Manufacturing

Through Hole Manufacturing

• Processes
  • Hand Soldering
  • Soldering “robot”
  • Wave soldering
    • Design Criteria
    • Pallets
  • Selective soldering
    • Design Criteria
    • Keepouts
• Lead Forming
  • Pre purchase?
  • Forming with a die?
  • Using hand tools?
• PCB design
  • Holes
  • Non circular?
  • Annular rings
  • IPC stuff
    • IPC-2221 Generic Standard on Printed Board Design
    • IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards
    • IPC-2223 Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
    • IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard
      • Performance Classification (1,2,3)
      • Producibility Levels (A,B,C)
      • Land Pattern Determination (Density level A,B,C)