We record live at IMAPS to follow a first-time attendee’s leap into advanced packaging and a trio of high school students discovering semiconductors, robotics, and career paths that bridge disciplines. Along the way, we unpack speed-to-market, standards, hybrid vs TCB, and why AI skills matter.
• why a self-funded first conference can reset a career
• key takeaways from PDCs and technical talks
• time-to-market pressure across packaging workflows
• standards tension between front-end and packaging
• hybrid bonding promise versus TCB workhorse reality
• how to network with intent and follow through
• volunteering with IMAPS to build early-career hubs
• robotics as an on-ramp to semiconductors
• interdisciplinary routes into microelectronics
• student goals, mentors, and university paths
• practical questions to ask on the expo floor
