Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, machine learning, and quantum technologies.
Dariush and Rose share their wealth of knowledge on material characterization, modeling, and application engineering, and discuss how Henkel maintains its pivotal role within the semiconductor ecosystem. From underfills to thermal interface materials, discover how comprehensive material offerings are shaping the future of high-performance computing.
Explore the fascinating advancements in material modeling for semiconductors, where physics-based simulations are transforming reliability testing and development cycles.
Gain a clearer understanding of capillary underfill materials and their vital role in enhancing solder joint reliability under thermal stress.
This episode delves into the collaboration between material developers and modeling experts, underscoring the importance of early customer engagement to tailor innovative solutions.
If you are interested in learning how cutting-edge materials are propelling the semiconductor industry forward, this conversation is a must-listen.
Contact the Speakers on LinkedIn
Dariush Tari, Henkel Semiconductor Packaging Materials
Rose Guino, Semiconductor Packaging Materials
