Shows
3D InCites PodcastECTC at 75: Pioneers Reflect on Packaging's Past and FutureSend us a textWhat happens when you gather 75 years of packaging innovation under one roof? The Electronic Component Technology Conference (ECTC) has transformed from a modest gathering of 300 electronics professionals to a powerhouse event attracting over 2,500 industry leaders, researchers, and visionaries. This remarkable journey reflects how advanced packaging has evolved from supporting technology to the driving force behind modern electronics.In this special episode, we speak with three generations of ECTC committee members: Pat Thompson (with 41 years of ECTC experience), Przemek Gromala (10 years), and Florian Herault (since 2010). They share fascinating insights into how the...2025-06-0527 min3D InCites PodcastKoh Young's Michael Zahn Talks About Putting 3D Measurement Technology to Work for Semiconductor ManufacturingSend us a textThis episode was recorded live at SEMICON Europa. Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies. They discuss the transition from 2D to 3D measurements in semiconductor manufacturing. Zahn explains why non-destructive, optical 3D measurements offer precise height and position data with sub-micron resolution. You'll learn how these measurements are crucial for early defect detection, improving efficiency, and reducing waste. You'll also gain an understanding about the importance of real-time, in-l...2024-12-1218 min3D InCites PodcastSEMICON Europa 2024: Can Digital Twins Help Solve Europe's Talent Gap and Build Technical Sovereignty?Send us a textIn this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe’s technical sovereignty, and how implementing digital twins can help achieve this goal. John Behnke, of Inficon, discussed the evolution of smart manufacturing in the semiconductor industry. He highlighted how smart software can increase factory productivity by 5-15% by making autonomous decisions based on digital twins. You’ll learn about Behnke’s vision for the Smart Control Room. Catherine Le Lan, Synopsys, emphasized the need...2024-11-2846 min3D InCites PodcastThe U.S. CHIPS for America Mash-UpSend us a textIt's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline of the year's progress. First up is Dan Berger, National Advanced Packaging Manufacturing Program (NAPMP), who explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US sem...2024-11-1444 min3D InCites PodcastOnto Innovation's PACE Partners Talk About Collaborating on Panel-Level PackagingSend us a textOn September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of PLP technologies for both organic and glass substrates. These include 3D InCites Members: LPKF Laser & Electronics, Evatec, MKS-Atotech and Lam Research; as well as Resonac, Corning, and others.This episode starts off with a conversation with Onto Innovation CEO, Mike Plisinski, w...2024-11-071h 073D InCites PodcastWitnessing Foundry 2.0 In Action with NHanced Semiconductor's Bob Patti and Carl PettewaySend us a textFor this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors. She speaks with founder and CEO Bob Patti about his vision for the company, which is based on implementing the Foundry 2.0 business model he conceptualized. It involves sourcing dies and chiplets from traditional foundries and applying semiconductor foundry processes and advanced packaging and assembly technologies. You'll learn:What's driving the transition to advanced packaging from traditional scalingWhy the traditional foundry model may not be the way goin...2024-10-3053 min