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3D InCites PodcastThe Wireless Golden Gateway: Why Advanced Packaging Professionals Should Attend IMS 2025Send us a textThe IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee explain why this premier event, taking place in San Francisco's Moscone Center from June 15-20, has become increasingly relevant to professionals in advanced packaging and heterogeneous integration.• Approximately 15% of accepted papers directly address packaging and heterogeneous integration topics• Papers undergo rigorous double-blind review with an in-person committee meeting to ensure highest quality content• Technical focus includes laminate technology, chip s...2025-05-1531 min